InduSoft representatives recently attended the Pack Expo show in Las Vegas last week, and brought back some interesting images and comments from the show. According to Scott Kortier, “The show was really well attended this year. Everyone came out.”
Trends this year that are high on packaging industry leader’s minds are SCADA software solutions with excellent database connectivity, like that found with InduSoft Web Studio, which has a patent for connecting to any SQL database on Windows CE devices. Other points of interest among attendees were OEE solutions. There was a great deal of attention paid to the InduSoft Web Studio OEE Demo.
Want to see more of what InduSoft had to offer? Click here to download the sample packaging SCADA application.