InduSoft will be attending Pack Expo next month with partner Beckhoff to showcase Indusoft SCADA/HMI software solutions for packaging automation.
Pack Expo takes place from September 23-25 in Las Vegas, Nevada. Visit InduSoft in booth C2927 with partner Beckhoff.
Location: Las Vegas Convention Center, Las Vegas, Nevada, USA
Date: September 23-25, 2013
Time: 9am-4pm daily
For more information on InduSoft Web Studio’s successes in packaging, please visit our packaging automation page, where you’ll find case studies, sample applications, webinars, and more.
Click here for more information about Packaging automation with InduSoft Web Studio!